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Jodi Allen (Investor Relations)
(973) 357-3283

Sherry Sutton Anderson (Marketing Communications)
(973) 357-3266


Cytec to Exhibit Innovative Solutions for Food Packaging Applications at TAPPI PLACE

Woodland Park, NJ – April 8, 2010 – Cytec Industries Inc. (NYSE: CYT) announced today that it will present its GPM-produced EBECRYL® LEO energy curable resins for food packaging at the upcoming 2010 TAPPI PLACE Conference. The Conference is taking place at the Albuquerque Marriott in Albuquerque, NM from April 18-21, 2010.

The company will present two papers:

  • “Low Odor/Low Extractable Energy Curable Acrylates for Food Packaging Applications” by Mouhcine Kanouni, Technical Service and Development Manager, on April 20th from 8:00 – 10:00 as part of Session #8 on Materials for Flexible Packaging.

  • “Promoting UV Flexo Ink Adhesion for Flexible Packaging” by Andrew Seecharan, Technical Service and Development, on April 21st from 10:30-12:30 as part of Session #20 on Surface Treatment. This paper will be co-presented with Rory Wolf of Enercon Industries.

Cytec is a pioneer in the development of UV/EB curable or resins and additives that allow its customers to create sustainable change for the industries they serve. Further information about Cytec’s products is available on the company’s website.

Corporate Profile
Cytec Industries Inc. delivers specialty chemicals and materials technologies beyond our customers’ imagination. Our focus on innovation, advanced technology and application expertise enables us to develop, manufacture and sell products that change the way our customers do business. These pioneering products perform specific and important functions for our customers, enabling them to offer innovative solutions to the industries that they serve. Our products serve a diverse range of end markets including aerospace composites, structural adhesives, automotive and industrial coatings, chemical intermediates, electronics, inks, mining and plastics.
 

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